—Capacitive Micromachined Ultrasonic Transducers (CMUTs) are normally fabricated possibly by regular sacrificial release system or by wafer bonding technique. From the former, sacrificial layers are patterned with deposited components within the substrate. This existing work reviews a development on the aforementioned technique wherein sacrificial islands are embedded inside of grooves http://manuelhihj915.theburnward.com/14-common-misconceptions-about-band-gap-of-silicon-carbide